Product Details
- Single six-axis structure for FA coupling, with separate dispensing and UV curing processes
- Automatic pick-up and tracking of MPO connectors during coupling
- Convenient loading and unloading procedures enable quick and easy handling of FA and PCB
- Pressure sensors are used to detect contact between the FA and the silicon photonics chip (force < 10g).enabling micron-level precision control of the gap between chips and FAs
- Utlises linear motor drives with a closed-loop precision of 25nm, offering high-speed and high-precision performance
- The use of high-precision, force-feedback electric suction-gripping integrated grippers enables high-precision,stable gripping of FA
Application Fields
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optical fiber communication
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fiber optic sensing
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High power laser
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Laser projection
