With the development of the Chinese economy and the deepening implementation of national strategies, the demand for automation and intelligent production modes in the manufacturing industry is increasing day by day, and new high-power, high-efficiency, and high stability semiconductor laser products are constantly emerging. Laser coupling packaging equipment, as a key equipment in the high-end manufacturing field, is gradually becoming an important support for the transformation and upgrading of China's manufacturing industry, and will usher in more development opportunities and space.

In the current era that calls for specialization, refinement, and innovation, Hostechn adheres to the corporate culture of "intelligence, action, and practicality" by breaking through technological barriers. The innovative development of high-power semiconductor laser coupling packaging equipment products has filled the domestic gap and become a microcosm of the innovation and breakthrough in China's laser coupling packaging equipment industry.

Establishing a business through scientific and technological innovation, deeply cultivating the industry for more than ten years

Hunan Hostechn Automation Technology Co., Ltd. (hereinafter referred to as Hostechn) was established in 2015 and is located in the beautiful city of Changsha. It is a manufacturer that provides professional automation production equipment and solutions for optoelectronic enterprises. The company has currently completed the research and promotion of coaxial laser/detector automatic coupling equipment, COB optical module automatic coupling machine, butterfly device automatic coupling machine, FAC automatic coupling machine, reflector automatic coupling machine, VBG automatic coupling machine, and other customized equipment. Up to now, more than 20 optical coupling devices have been sold domestically and internationally, with a total quantity of over 1000 units.

The founders of Hostechn are all from the doctoral team at Zhongnan University. The team members have been dedicated to developing equipment for optoelectronic packaging since 2008 and have rich industry experience. The company continues to innovate around customer needs, focusing on achieving fully automated production of optoelectronic devices. It has accumulated 11 authorized invention patents, over 20 utility model and software copyrights, and more than 10 patent applications. Having been deeply involved in the industry for many years, the company has been awarded multiple honorary titles such as National High tech Enterprise, Hunan Province Specialized, Refined, Unique and New Enterprise, Technology based Small and Medium sized Enterprise, Innovative Small and Medium sized Enterprise, and Changsha Gazelle Enterprise. It has also won the first prize of Hunan Province Technology Invention Award in 2021 and successfully exported equipment abroad, improving the packaging automation level of the optical device industry and gaining recognition and praise from customers.

Focus on the track and build core technological barriers

Explore the path of technological innovation and help the industry achieve new success. Hostechn not only values market demand and service quality, but also pursues innovation in the field of technology. It has invested a lot of effort and resources in the research and development of high-power semiconductor laser coupling packaging equipment, and has effectively built significant technical barriers. We have pioneered key technologies such as global optimization search for optical channel coupling position, sub micron precision motion design and control technology, high-precision motion platform, high-precision dispensing machine, high-speed high-precision linear motor, force controllable high-precision electric gripper, etc., which can achieve coupling alignment accuracy of 0.1um and 0.01 °, dispensing accuracy of 0.1uL, device curing loss less than 0.2dB, and strong equipment compatibility for secondary development.

The product has overcome the challenges of semiconductor laser coupling packaging and the bottleneck of automation coupling technology, breaking the monopoly of international products on the domestic market and achieving independent and controllable key technologies of self-developed equipment. Compared to devices such as FicontEC from Germany and Suruga from Japan, the coupling search speed has been more than doubled, the packaging time has been reduced by 50%, and the equipment price has been reduced by more than 70%. The related technological achievements have been applied to more than 50 domestic and foreign enterprises and research institutes such as Ruike Laser, Keplin Optoelectronics, and the Institute of Semiconductors of the Chinese Academy of Sciences. We have achieved automation, localization, and efficient coupling packaging of semiconductor lasers in China, saving the industry billions of production costs.Hostechn has a domestic market share of 50% in the subdivision field of high-power semiconductor laser coupling packaging equipment, and was awarded the "Key Recommended Brand" in the "Brand China" column in 2024, with its brand awareness and market influence continuing to rise.

As a pioneer in high-power semiconductor laser coupling packaging equipment, Hostechn always adheres to the integration of intelligence and action, making every use of it, and taking technology and innovation as the principles of enterprise survival. We are dedicated to providing customers with higher quality production automation solutions. Committed to becoming the world's leading supplier of laser coupling and packaging equipment, with continuously upgrading and evolving technological achievements and integrated solution services to support the high-quality development of the industry.